PCB common words (English words) 1. A-STAGE A stage
Refers to the film (PREPREG) manufacturing process, when the glass cloth or cotton paper of the reinforcing material is impregnated through the glue tank, the resin glue (Varnish, also translated as varnish water) is still in the monomer and is The state of solvent dilution is called A-Stage. Relatively, when the glass cloth or cotton paper is sucked into the glue and dried by hot air and infrared rays, the molecular weight of the resin will increase to the complex or oligomer (Oligomer). It is attached to the reinforcing material to form a film. The resin state at this time is called B-Stage. When it is further heated and softened, and further polymerized into the final polymer resin, it is called C-Stage.
2.Addition agent----
Process additives to improve product properties, such as gloss or leveling agents required for electroplating.
3. Adhesion----
refers to the adhesion strength of the surface layer to the main body, such as the green paint on the copper surface, or the copper skin on the substrate surface, or the adhesion between the plating layer and the substrate.
4.Annular ring
Refers to the copper ring that is flat on the surface of the board around the through hole. This hole ring is often connected to the outside ground by a cross bridge on the inner layer board, and is more often used as the end point or passing station of the line. In addition to being used as a transit station on the line, it can also be used as a pad for pin welding of parts. Synonymous with this word are pad (distribution ring), land (independent point), etc.
5.Artwork negative film---
In the circuit board industry, this word often refers to black and white negatives. As for the brown "azo film" (Diazo Film), it is also named after the phototool. The negatives used for PCBs can be divided into "original negatives" Master Artwork And the reprinted "working negative" working Artwork, etc.
6.Back-up pad
It is padding under the circuit board during drilling, which is in direct contact with the machine table, which can avoid the damage of the drill and the table, and reduce the temperature of the drill, remove the waste debris in the chip removal groove, and reduce the occurrence of burrs on the copper surface, etc. Function. Generally, phenolic resin board or wooden paddle board can be used as raw material.
7. Binder
Various adhesives in the laminate, or the dry film of the resist, added to "form" not too "scattering" adhesives and forming agents.
8.Black oxide
In order for the multilayer board to maintain the strongest fixing force after being pressed, the copper conductor surface of the inner layer board must first be coated with a black oxide layer. At present, this roughening treatment is in order to adapt to different According to the needs, the improvement is browning treatment (Brown Oxide) or redning treatment, or brassing treatment.
9. Blind Via Hole
Refers to the complex multi-layer board, some of the via holes only need a few layers of interconnection, so it is deliberately not completely drilled through, if one of the holes is connected to the ring of the outer layer, this kind of cup-shaped The special hole in the dead end is called "Blind Hole".
10. Bond strength
refers to the strength of the unit (LB/IN2) applied per unit area when the adjacent layers are forced to be separated by force in the reverse direction (not torn).
11.Buried Via Hole
refers to the local via hole of the multilayer board. When it is buried in the "inner through hole" between the layers in the multilayer board and is not "connected" with the outer layer board, it is called a buried via hole or simply a buried hole.
12. Burning
refers to the area where the current density of the coating is too high, the coating has lost its metallic luster, and it appears as an off-white powder.
13.Card card board
is an informal term for circuit boards, often referring to narrow or long boards with peripheral functions, such as adapter cards, memory cards, IC cards, and smart cards.
14.Catalyzing
"Catalysis" is an additional "introducer" added to each reactant before the general chemical reaction, so that the required reaction can be carried out smoothly. In the circuit board industry, it refers specifically to the PTH process, its "palladium chloride" "The activation catalysis of the non-conductor sheet by the bath solution first buries the growing seeds of the electroless copper plating, but this academic term is now more commonly known as "Activation" or "Nuclearization" ( Nucleating) or "" (Seeding). Another Catalyst, its correct translation is "catalyst".
15.Chamfer chamfering
In the gold finger area of the board edge of the circuit board, in order to facilitate the connection of the continuous contacts, not only to complete the work of cutting the bevel edge (Bevelling) on the front edge of the board edge, but also the board corner or direction slot (slot) The right angles of the mouth are also removed together, which is called "chamfer". It also refers to the chamfer between the end of the shank and the shank of the drill.
16.Chip die, chip, flake
At the heart of various integrated circuit (IC) packages, die or chip (CHIP) with dense lines are installed. This kind of small "circuit chip" is a wafer (Wafer) assembled from multiple chips. ) From the above.
17.Component Side
In the early era of full-through-hole insertion of circuit boards, the parts must be installed on the front of the board, so the front side is also called the "component side"; the back side of the board is only passed through the wave soldering tin wave, so it is also called It is "Soldering Side". At present, SMT boards must be bonded on both sides of the board, so there is no longer a "component side" or "solder side". It can only be called the front or back. Usually the front will be printed with The name of the manufacturer of the electronic device, and the UL code and production date of the circuit board manufacturer can be added on the reverse side of the board.
18.Conditioning the whole hole
The term broadly refers to its own "adjustment" or "adjustment" to enable it to adapt to later conditions, and narrowly refers to the fact that dry plates and pore walls are "hydrophilic" and with "before entering the PTH process. "Positive charge", and at the same time complete the cleaning work, can continue to carry out other subsequent treatments. Before this through-hole process is launched, the action of finishing the hole wall first, called hole conditioning (Hole conditioning) treatment.
19.Dent depression
refers to the gentle and uniform depression on the copper surface, which may be caused by the localized protruding part of the steel plate used for lamination.If there is a regular decline in the fault edge, it is called Dish Down.
20. Desmearing slag removal
Refers to the circuit board in the frictional heat of drilling, when its temperature exceeds the Tg of the resin, the resin will soften and even form a fluid and coat the hole wall with the rotation of the drill bit.After cooling, it forms a fixed paste residue, making the inner layer of copper The gap between the hole ring and the copper hole wall made later. Therefore, at the beginning of PTH, the formed slag should be removed by various methods to achieve the purpose of subsequent good connection (Connection).
21. Diazo Film
It is a negative film with a brown light-blocking film. It is a special exposure tool for ultraviolet light (PHOTOTOOL) when transferring dry film images. This azo brown film can be in "visible light" even in the brown shading area. It is more convenient to see through the bottom plate of the film than the black and white film.
22.Dielectric medium
It is the abbreviation of "dielectric substance", which originally refers to the insulation between the two plates of the capacitor, and now generally refers to the insulation between any two conductors, such as various resins and matched cotton paper, and glass cloth, etc. All belong to it.
23. Diffusion Layer
is another name for the extremely thin "cathod film" formed on the cathode surface of the plated parts in the liquid during electroplating.
24. Dimensional Stability
Refers to the change in length, width, and flatness of the board under the influence of temperature change, humidity, chemical treatment, aging (Aging), or applied pressure, which is generally expressed as a percentage. When the PCB board surface is away from the vertical highest point of the reference plane (such as a marble platform), then the thickness of the board is deducted, which is its vertical deformation, or the height of the board is measured directly by using a steel needle for aperture measurement. The amount of deformation is used as a molecule, and then the length of the board or the length of the diagonal is used as the mother component. The resulting percentage is the characterization of scale stability, commonly known as "dimensional stability".
25. Drum Side copper foil smooth
The electroplated copper foil is plated with copper foil on the smooth "titanium carcass" of the stainless steel cathode wheel (Drum) with high current density (about 1000ASF) in copper sulfate solution. The rough rough surface of the liquid and the smooth carcass surface close to the wheel body, the latter is called "Drum Side".
26. Dry Film
It is a dry photosensitive film resist used for circuit board image transfer, and it is also sandwiched by two layers of PE and PET to protect it. The PE isolation layer can be torn off during site construction to allow the middle photosensitive resist film Pressed on the copper surface of the board, after the negative film is exposed, the PET surface protective film can be torn off, washed and developed to form a partial resist of the circuit pattern, and then etching (inner layer) or electroplating ( Outer layer) process, and finally after etching copper and stripping the film, the board surface with bare copper lines is obtained.
27. Electrodeposition electroplating
Direct current is applied to the electroplating solution containing metal ions, so that the metal can be plated on the cathode. This term is also synonymous with Electroplating, or simply plating. The more formal way is electro ytic plating. It is a kind of experience. Yuxue's processing technology.
28. Elongation
often refers to the part of the metal that will grow under tension (tension) until it breaks before it occurs.The percentage of the original length is called elongation.
29. Entry Material Cover
When drilling the circuit board, in order to prevent the pressure foot on the drill shaft from causing indentation on the board surface, an additional aluminum cover plate is required on the copper foil substrate. This cover plate also has the ability to reduce the sway and slip of the drill pin. Reduce the heat of the drill and reduce the generation of hairs and other functions.
30. Epoxy Resin
It is a thermosetting polymer with extremely wide application. It can be used for molding, packaging, painting, and adhesion. In the circuit board industry, it is the most expensive insulation and bonding application. The resin can be combined with glass cloth, glass cloth mat, and white kraft paper to form a plate, and can accommodate various added additives to achieve the purpose of flame retardancy and high function.It is used as a base material for circuit boards at all levels.
31. Exposure
Using the energy of ultraviolet (UV) energy, the photosensitive material in the dry film or printing ink undergoes a photochemical reaction to achieve the effect of selective local bridge hardening, and the purpose of completing image transfer is called exposure.
32. Fabric fabric
refers to the carrier "gang cloth" stretched on the frame by the printing plate, usually its material is polyester (Polyester, pet) stainless steel and nylon (Nylon), etc., the term is also called cloth.
33. Haloing white edge, white circle
It refers to the phenomenon that when the board of the circuit board is being drilled, slotted and other mechanical actions, once it is too fierce, it will cause the internal resin to break or the micro layer to crack, which is called HaLoing. The original meaning of the word halo refers to The halo above the Western "God" is similar to the "white circle" appearing on the board, so it is particularly extended to become the term for the circuit board. In addition, the original "pink circle" is also used by the word Pink Halo .
34. Hot Air Levelling
The green printed semi-finished board is immersed in molten tin, so that the hole wall and the bare copper pad are covered with solder, and then immediately lifted from the tin bath, and then the hole is filled with high pressure hot air from both sides. The tin is blown out, but the hole wall and the board surface are still covered with a layer of solder that is helpful for soldering. This process is called "spray tin", which is directly translated by the mainland industry as "hot air leveling." Because of the traditional vertical Tin-spraying will cause the phenomenon of "Solder Sag" on the lower edge of each upright solder pad, which is very unfavorable for the stability of surface bonding, and may even cause footless resistors or capacitors to weld at both ends. Under the imbalance of power, the tombstoning effect of instantaneous floating during welding increases the trouble of post-weld repair. The new "horizontal spray tin" method, the tin surface is very flat, can avoid this phenomenon.
35. Internal Stress
When the metal lattice structure (Lattice Structure) is deformed by the "external force" in the Elastic Range, it is called "elastic deformation". However, if the external force is large and exceeds the elastic range, it will cause another A plastic deformation (Plasic Deformation), also known as "slip" (Slip), once so, even after the external force is removed, it cannot be restored. The former elastically deformed metal atom wants to return to its original force, which is called "elastic stress" (Elastic Stress) is also called "Internal Stress" (Internal Stress), also known as "Residual Stress" (Residual Stress).
36. Kraft Paper
When laminating or laminating the multi-layer board or substrate board, kraft paper is used as a heat transfer buffer. It is placed between the hot plate (Platern) of the laminating machine and the steel plate to ease the closest The heating curve of bulk materials. Make the temperature difference between the multiple layers of substrates or multilayer boards as close as possible to the temperature of each layer of the board. The commonly used specifications are 90 pounds to 150 pounds. Because of the high temperature and high pressure, the fibers in the paper It has been crushed and no longer has a toughened surface that is difficult to function, so you must try to replace it. This kind of kraft paper is a mixed solution of pine wood and various strong alkalis. After the volatiles escape and the acids are removed, then Carry out water washing and precipitation; after it becomes pulp, it can be pressed again to become rough and cheap paper.
37. Laminate (s) substrate, laminate
Refers to the substrate board used to manufacture the circuit board, referred to as the substrate. The structure of the substrate is a film (Prepreg) composed of resin, glass fiber cloth, glass fiber mat, or white kraft paper as an adhesive layer. It is a composite plate formed by laminating with copper foil overlaid and then pressed in high temperature and high pressure. Its official name is copper foil substrate CCL (Copper Claded Laminates).
38.Lay Up
Before laminating the multi-layer board or substrate, various loose materials such as inner layer board, film and copper skin, steel plate, kraft paper padding, etc. must be aligned, aligned, or registered for convenience. Can be carefully fed into the press for heat
2020 07/01